Our Solutions

Discover fiber optic solutions for different industry applications and deployment scenarios.

FTTH ODN Planning for GPON & XGS-PON

Plan FTTH passive infrastructure from the serving area, split topology and optical-loss budget through cables, closures, boxes and field acceptance.

Map the complete patch cord workflow from cable preparation and curing through polishing, end-face inspection, IL/RL testing and release.

Select high-density MPO and LC assemblies from the exact transceiver MDI, fibre type, polarity, lane map, reach and channel-loss budget.

Plan outdoor fibre assemblies by the radio interface, connector system, route, sealing, bend control and documented field-test criteria.

Define PLC assembly or FBT tapering workflows, optical test requirements, packaging, environmental qualification and traceability.

Engineer GPU-cluster cabling from endpoint optics, MPO interface, lane mapping, topology, pathway density and the complete channel-loss budget.

Specify connector, fiber mode, polish, polarity, length, jacket and optical acceptance for telecom, FTTH and data center patch cords.

Choose cable construction by fiber type, count, route, tensile load, water blocking, bend radius, sheath and installation environment.

Match PLC split ratio, wavelength, package, connector and maximum loss to a documented GPON or XGS-PON ODN budget.

Select G.657 drop cable profiles, strength members, span, bend, jacket and termination for the last-mile route.

Match SC, LC, FC, ST, E2000 or bare-fiber adapters by polish, sleeve, flange, mounting and cleanliness requirements.

Design multi-fiber trunks and breakouts from the endpoint MDI, lane map, polarity, keying, gender and channel-loss budget.

Select SFP, SFP+, SFP28, QSFP+ or QSFP28 modules by host coding, wavelength, reach, fiber, temperature and diagnostics.

Compare CWDM and DWDM grids by channel plan, mux loss, transceivers, dispersion, power budget, monitoring and upgrade path.

Choose polishing machines by connector fixture, ferrule count, polish recipe, throughput, inspection and optical acceptance.